IoT Product Launch Package (Turnkey Prototype Development)

$0.00

A fixed-scope, end-to-end IoT development service that transforms your idea into a working, near-production-ready IoT prototype—including hardware, firmware, and cloud connectivity—delivered in 8–12 weeks.

Description

This package is designed for:

  • Non-technical founders

  • Startups validating an IoT idea

  • Small businesses launching a connected product

If you have a concept or use case but don’t want to manage multiple vendors for hardware, firmware, and cloud integration, this service gives you a single, accountable delivery.

This is a fixed-scope, fixed-price engagement covering the complete IoT stack—from architecture to working hardware.


Phase 1: Requirements & System Architecture

  • Functional and non-functional requirements definition

  • Component selection:

    • MCU / SoC

    • Sensors & peripherals

    • Power architecture

    • Connectivity (Wi-Fi / Cellular / BLE as applicable)

  • High-level system architecture diagram

📄 Deliverable: Requirements & Architecture Document


Phase 2: Hardware Design

  • Complete schematic design

  • PCB layout optimized for prototyping and testing

  • Design-for-manufacturing considerations (early-stage)

📄 Deliverable: Prototype-ready schematic & PCB files


Phase 3: Prototype Manufacturing & Testing

  • Assembly of 3 fully functional prototype units

  • Power-up, bring-up, and basic functional validation

  • Hardware test results documented

📦 Deliverable:

  • 3 assembled & tested prototype devices

  • Hardware test report


Phase 4: Core Firmware & Cloud Connectivity

  • Embedded firmware development:

    • Sensor drivers

    • Device logic

    • Power management

  • Cloud connectivity implementation:

    • Wi-Fi / MQTT / HTTP (as required)

  • Basic data publishing and device communication

💻 Deliverable:

  • Firmware source code

  • Cloud connectivity demo working end-to-end


Phase 5: Documentation & Handover

You receive everything needed to continue development or move toward production:

  • Bill of Materials (BOM)

  • Schematics & PCB files

  • Firmware source code

  • Test & validation summary

📁 Deliverable: Complete documentation package


Timeline

8–12 weeks, depending on product complexity and component availability.